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Intel’s headquarters in California, U.S. Photo courtesy of Intel |
Malaysian Prime Minister Anwar Ibrahim on Dec. 1 announced on Facebook that Intel CEO Lip-Bu Tan had confirmed the additional investment to make Malaysia a key hub for the company’s chip assembly and testing activities. The decision reflects Intel’s confidence in Malaysia’s long-term strategic plans.
Construction of Intel’s advanced chip packaging plant in Penang, northern Malaysia, is now 99% complete, with the company expressing appreciation for government support.
Malaysia is the world’s sixth-largest semiconductor exporter and holds a 13% global market share in chip assembly, packaging, and testing. In 2021, Intel pledged $7 billion to build the Penang facility, located in the country’s electronics hub.
The US is Malaysia’s third-largest market for semiconductor exports. In 2024, Malaysia exported 120 billion MYR ($28 billion) in electrical and electronic products to the U.S., with around half related to chips.